CAPPA is involved in the advanced research of nanophotonics through the nanophotonics group at CAPPA. The nanophotonics group uses nanoscale devices (smaller than a hair’s width) to control and manipulate light. By nanostructuring high refractive index silicon based materials, light can be confined in volumes on the order of a cubic wavelength. A particular goal of the group is the demonstration of a low power consumption optical interconnects based on low capacitance photonic crystal cavities that are compatible with the fabrication process of the electronics industry. The group’s main research goal is the realisation of a new family of low power optical interconnects using Nanophotonics.
Recent Research Highlights
Analytical Chemistry article on Deep UV Laser Induced Fluorescence for Cleaning Validation
CAPPA researchers Krishnakumar Chullipalliyalil, Liam Lewis and Michael McAuliffe were authors on a recent article published in Analytical Chemistry. The article focused on Deep UV laser induced fluorescence for cleaning validation. The paper discusses the use of DUV laser induced fluorescence for detecting carryover of API’s and detergents onsite. A modified spectrometer is used as an offsite bench type prototype for analysing trace samples of API and cleaning detergents with various substrates. Even if the API to be detected has a low fluorescence efficiency, the specificity of the technique allows API concentrations as low as ≈ 0.20 μg/cm2 to be identified. The work also shows the possibility of using a probe for validating cleaning of hard to reach areas using DUV laser induced fluorescence.
See the full paper here: Chullipalliyalil, K., Lewis, L., & McAuliffe, M.A.P. Analytical Chemistry, 92(1), 1447-1454(2020) S. Biswas, J. Doherty, D. Saladukha, Q. Ramasse, D. Majumdar, M. Upmanyu, A. Singha, T. Ochalski, M. A. Morris, and J. D. Holmes, Nature Communications, 7, 11405, (2016).
CAPPA has access to the cleanroom facilities at Tyndall through the CAPPA@Tyndall partnership. Tyndall central fabrication facilities consist of three distinct cleanroom spaces; 250m² of class 1,000 and class 10 for silicon fabrication, 750m² of class 10,000 and class 100 for MEMS and compound semiconductor fabrication and 40m² of class 1000 for e-beam lithography. Tyndall’s flexible fabrication offering – FlexiFab, is in a unique position to allow for greater material exchange between the fabrication areas, whilst maintaining protocols to avoid cross contamination.